This summary of the video was created by an AI. It might contain some inaccuracies.
00:00:00 – 00:12:26
In the video, AMD announced new Zen 5 CPUs with improved IPC uplift, new chipsets, and mobile CPUs set for release in July 2024. The company discussed naming scheme changes, TDP adjustments, and improved architecture in the CPUs. AMD also highlighted IPC uplift for Zen 4 CPUs and extended the AM5 socket life. Additionally, new products like Instinct Mi 325x GPUs and fifth gen EPYC CPUs were revealed, hinting at a competitive tech industry landscape. The video also mentioned upcoming content on the channel, encouraging viewers to subscribe for regular updates.
00:00:00
In this segment of the video, AMD has announced its new Zen 5 CPUs, including the 9950 X, with a projected 16% average IPC uplift compared to the previous generation. They have also introduced new chipsets like x870 and x870 and new mobile CPUs, in addition to the Ryzen 9000 Series and the AM4 Ryzen 5000 Series CPUs in the XT lineup. The video gives a brief overview of the CPUs announced by AMD, including core counts and specifications slated for release in July 2024.
00:03:00
In this part of the video, AMD is discussing its new CPUs, such as the 9700X and 9600X, which have higher clock speeds and lower TDP compared to previous models. The company is also introducing the R9 5900 XT and R7 5800 XT AM4 CPUs, with a brief mention of potential prices before retracting the information. The 5900 XT is a 16-core CPU, setting it apart from previous XT refreshes, while the 5800 XT remains an 8-core CPU. AMD is adjusting its naming scheme for CPUs like the Ryzen 3000 AI series, aiming for clarity and understanding.
00:06:00
In this segment of the video, AMD has made changes to their naming scheme and suffixes, with the HX now indicating the top-of-the-stack solution rather than thermal indicators. The 300 series CPUs will offer a configurable TDP ranging from 15 to 54 watts. The AI 9 HX 370 is a 12-core CPU on Zen 5 with a Max boost of 5.1 GHz and peak npu tops of 50 Terra operations per second. The AI 9 365 is a 10-core CPU at up to 5 GHz with an 880m igp. AMD announced improvements in Zen 5 architecture such as better branch prediction accuracy and reduced latency, higher throughput, and deeper parallelism design. They will support USB 4 on all boards and PCIe Gen 5 support. Additionally, AMD announced their solution as the world’s first block fp16 mpu. Performance testing will be conducted once these CPUs are available for review.
00:09:00
In this segment of the video, AMD discusses the IPC uplift ranging from 10 to 35% for its Zen 4 CPUs, with an average of 16%. They claim a 7 to 56% uplift in various production workloads and mention Snapdragon in their presentation. AMD announced the extension of its AM5 socket life to 2027 and beyond, showing a strong commitment to platform longevity. Additionally, AMD revealed new products like the Instinct Mi 325x GPUs, fifth gen AMD EPYC CPUs, and their focus on Ultra ethernet for scaleout AI infrastructure, positioning themselves against Nvidia’s NV link. This sets the stage for an exciting battle in the tech industry.
00:12:00
In this segment of the video, the speaker mentions upcoming content on the channel including Anex, Fantex Le, and Lee roundups, as well as a review of Scythe and its new CPU coolers. They encourage viewers to check back regularly as there will be multiple posts daily throughout the week. The audience is asked to subscribe for more videos due to YouTube not sending notifications for all uploads.